Module 2 (Hardware Repair & IC Reballing)

• Introduction to Printed Circuit Board (Motherboard).
• Details of various components in the PCB.
• Identify BGA, EMMC
• Introduction to stencil
• Type of stencil
• IC Reballing with stencil
• Testing of parts and components.
• Learn about different ICs (chips) used on the motherboard.
• How to know about different ICs.
• Soldering & Desoldering of components by using a soldering iron.
• Soldering & Desoldering of components by using a rework station.
• Reheating and mounting of various BGA and SMD chips.
• Ultrasonic cleaning procedure.
• Different sections of mobile hardware (identification of hardware section on circuit board)
• Power Section, Network Section
• Charging section, camera section
• Audio Section, Touch & Display Section
• Smart Mobile Sections (Android & iPhone)
• Wi-Fi section, Bluetooth section

Module 3 (Software Repair)

• Detailed study of various faults arising due to corrupt software.
• All Drivers installation
• Flashing of various brands of handsets.
• Learn how to remove viruses from infected phones.
• Learn how to unlock handsets through codes and software.
• Learn how to use various secret codes.
• Flashing & Unlocking UMT Dongle

Module 4 (Troubleshooting with Borneo schematics)

• Introduction Borneo schematics
• Using Borneo schematics
• Troubleshooting with Borneo schematics
• Fault finding, troubleshooting, and repairing of various faults.
• Learn common repair procedures for hardware-related faults.
• Learn common repair procedures for software-related faults.
• Learn the techniques of how to restore water-damaged smartphones.
• Circuit tracing, jumper techniques, and solutions.
• Troubleshooting through schematic diagrams.
• Use of the internet to find the faults and troubleshoot.
• Learn advanced troubleshooting techniques.
• DC Power supply Troubleshooting Phone Problems

Note: WE PROVIDE COMPLETELY PRACTICAL TRAINING